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Wafer inspection

  • Optical Measurement
    Rapid non-contact and non-destructive FTIR inspection system (configured with reflection and transmission measurement option) for epitaxial thickness, dielectric composition and high dopant concentration measurement for wafer maker and IC manufacturer industry.
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    EIR
    EIR
    En-Vision is a new generation inspection system specifically targeting quick and non-destructive detection of nm scale buried defects. Buried defects are located under the silicon surface, invisible to conventional inspection tools (Optical / SEM), and when occurring in the active areas impact device performance and yield.
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    PRODUCT
    En-Vision
    En-Vision
  • Electrical Measurement
    Semilab's COREMA system is based on a contactless capacitance technique used for precise resistivity characterization of semi-insulating compound semiconductors over a wide resistivity range, useful for the device manufacturing industry.

    Knowing the uniformity of resistivity and mobility values is critical to achieve process optimization.
    Mapping is critical for semi-insulating semiconductor QA processes as they show inhomogeneities that occur during manufacturing
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    PRODUCT
    Corema
    Corema
    All Semilab's MCV systems are equipped with automated, full hand-off, mercury handling system to increase safety and reliability. The user friendly software environment controls the measurements and also offers a great flexibility for detailed analysis of the measured structures. Full map capability up to 12"/300 mm. All features listed, including optional ones, are compatible with both the manual MCV-530(L) and the automatic
    MCV-2200/2500/3000/3000P systems.
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    PRODUCT
    MCV
    MCV
    The Semilab LEI family allows for non-destructive measurement of sheet resistance. These instruments are optimized for compound semiconductor applications with ranges of operation that dovetail nicely with customer applications. The LEI technology became the process of record in the RF device area with many people asking to see the “LEI” map.
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    PRODUCT
    LEI
    LEI
    SPL is a non-contact, non-destructive, spectroscopy-based measurement system to probe the electronic structure of different materials.
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    PRODUCT
    SPL
    SPL
    4 Point Probe (multiple heads) & Non-contact probes (JPV & EDDY) combined in one platform for better operability and long-term stability for wafer makers, device manufacturers and implanter suppliers.
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    RT
    RT
    Explore the entire carrier density and resistivity profile in all silicon semiconductor structures of device processing with this automated system. Measurement range covers state-of-the art application needs.
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    PRODUCT
    SRP
    SRP